Samsung hopes to improve the performance and efficiency of the Exynos 2400 by using FoWLP.
According to reports, Samsung is considering a major update to its Exynos chipsets in an effort to boost both performance and efficiency. Fan-out wafer-level packaging (FoWLP) is rumored to be used in the manufacturing of the forthcoming Exynos 2400 processor. The Exynos 2400, thanks to its new packaging, is anticipated to be more compact, powerful, and efficient than its predecessors.
FoWLP is a technique used to link the chipset to the motherboard and encase all of the integrated circuits in a package that safeguards the die. Because of the increased integration possible in a reduced package size, both thermal and electrical performance are enhanced. The Exynos 2400, if manufactured by Samsung using FoWLP, is anticipated to be as optimized and power-efficient as its Snapdragon competitors.
One Cortex-X4 core at 3.1GHz, two Cortex-A720 cores at 2.9GHz, three Cortex-A720 cores at 2.6GHz, and four Cortex-A520 cores at 1.8GHz are said to make up the Exynos 2400’s 1+2+3+4 design. An RDNA2 GPU codenamed Xclipse X940 (still in development) with features like 6 WGP (12 CU), 8 MB L3 cache, and hardware ray tracing will be used in the chipset as well.
Although Samsung has yet to confirm the existence of the Exynos 2400, speculation has it that it will power the next Galaxy S24. If Samsung can optimize other components and software to provide a considerably superior Exynos-powered model, it may be a game-changer for the firm. It should be stressed, however, that at present all of this is conjecture, and we must await additional industry leaks to validate any of these rumors.